Committees |
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Organizing Committee |
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General Co-chairs Ingrid Verbauwhede UCLA |
Hyung Roh Samsung |
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Program Co-chairs Rajiv Joshi IBM |
Kiyoung Choi Seoul National University |
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Treasurer Vijay Narayanan Penn State University |
Publicity Chair Luca Benini Università di Bologna |
Local Arrangements Chair Jihong Kim Seoul National University |
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Design Contest Chair Vivek Tiwari Intel Corporation |
Exhibits Chair Diana Marculescu Carnegie Mellon University |
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Executive Committee |
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B. Barton, Texas Instruments D. Blaauw, Univ. of Michigan R. Brodersen, UC Berkeley A. Chandrakasan, MIT E. Cheng, Synopsys J. Cong, UCLA G. DeMicheli, Stanford V. De, Intel Corporation C. Enz, CSEM |
M. J. Irwin, Penn State Univ. E. Macii, Poli di Torino F. Najm, University of Toronto M. Pedram, USC C. Piguet, CSEM J. Rabaey, UC Berkeley T. Sakurai, Univ. of Tokyo C. Svensson, Linkoping Univ. |
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Technical Program Committee |
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1.1 Technology & Digital Circuits |
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Chair K. Roy, Purdue University |
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S.-I. Chae, Seoul National University J. Figueras, Universitat Politecnica De Catalunya W. Hwang, National Chiao Tung University A. Inoue, Fujitsu Lab. Ltd. A. Keshavarzi, Intel Corporation L.-S. Kim, Kaist T. Kuroda, Keio University H. Makino, Mitsubishi Electric Corporation H. Mizuno, Hitachi, Ltd. T. Sakurai, Univ. of Tokyo D. Scott, Texas Instruments L. Svensson, Chalmers University N. Tzartzanis, Fujitsu Laboratories of America H.-S. Won, Samsung Electronics Co., Ltd. |
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1.2 Logic and Microarchitecture Design |
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Chair S. Kosonocky, IBM T. J. Walson Research Center |
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J. Arends, Motorola Inc. I. Bahar, Brown University S. Chakradhar, NEC Laboratories B. Falsafi, Carnegie Mellon University D. Garrett, Lucent Technologies S. Kim, IBM T. J. Watson Research Center S.-D. Kim, Yonsei University P. Kogge, Univ. of Notre Dame A. Kornfeld, Intel Corporation L.-H. Lee, Motorola Inc. K. Muhammad, Texas Instruments V. Oklobdzija, University of California M. R. Stan, University of Virginia J. Sparso, Technical University of Denmark J. Tierno, IBM T. J. Watson Research Center |
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1.3 Analog, MEMS and Mixed Signal Electronics |
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Chair S. Mukherjee, Philips Research USA |
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L. Breems, Philips Research B. Brodersen, University of California, Berkeley K. Kornegay, Cornell University S. Mattisson, Ericsson Mobile Platforms AB K. Najafi, University of Michigan S. Narendra, Intel Corporation H.-J. Park, POSTECH C.A.T Salama, University of Toronto F. Yamaguchi, Sony Corporation |
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2.1 Simulation and Estimation Tools |
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Chair E. Cheng, Synopsys Inc. |
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A. Bogliolo, University of Urbino Y. Cao, Kyushu University J. Henkel, NEC Corporation E. Huijbregts, Magma Design Automation Inc. Y.-H. Kim, POSTECH J.-T. Kong, Samsung Electronics Co., Ltd. M. Martonosi, Princeton University R. Marculescu, Carnegie Mellon University W. Nebel, Carl Von Ossietzky Universitat Oldenburg R. Panda, Motorola Inc. B. M. Pangrle, Synopsys Inc. V. Tiwari, Intel Corporation |
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2.2 Physical Design, Synthesis and Optimization Tools |
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Chair R. Mehra, Synopsys Inc. |
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J.-D. Cho, SungKyunKwan University K.-M. Choi, Samsung Electronics Co., Ltd. J. Cong, UCLA M. Nemani, Intel Corporation M. Poncino, Universita' di Verona G. Stamoulis, University of Thessaly K. Usami, Shibaura Institute of Technology H. Yasuura, Kyushu University R. Zafalon, STMicroelectronics |
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2.3 System and Software Design |
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Chair L. Benini, University of Bologna |
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K. van Berkel, Philips Research C. Chakrabarti, Arizona State University N.-H. Chang, Seoul National University P. Chou, University of California, Irvine N. Dutt, University of California, Irvine M. Kandemir, Pennsylvania State University H.-N. Kim, Electronics and Telecommunications Research Institute E. Macii, Politecnico di Torino B. Mangione-Smith, UCLA D. Marculescu, Carnegie Mellon University V. Narayanan, Pennsylvania State University G.-H. Park, Samsung Electronics Co., Ltd. C. Schurgers, Massachusetts Institute of Technology Y.-S. Shin, IBM T. J. Watson Research Center M. Srivastava, UCLA |
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