ISLPED 2026 IEEE/ACM International Symposium on Low Power Electronics and Design

Technical Program Committee

• Mehdi Kamal, TPC Co-Chair, USC

• Aatmesh Shrivastava, TPC Co-Chair, Northeastern

1. Technology, Circuits, and Architecture

1.1 Technologies and Circuits

• Deliang Fan (Track Co-Chair), Arizona State University

• Frank Gurkaynak (Track Co-Chair), ETH Zurich

• Fady Abouzeid, ST Microelectronics

• Amit Agarwal, Intel

• Laura Bégon-Lours, ETH Zurich

• Weidong Cao, George Washington University

• Manil Dev Gomony, TU Eindhoven

• Steven Hsu, Intel

• Inhee Lee, University of Pittsburgh

• Alexandre Levisse, EPFL

• Paolo Rech, Trento University

• Hechen Wang, Intel

1.2 Logic and Architecture

• Kshitij Bhardwaj (Track Co-Chair), Lawrence Livermore National Laboratory

• Rangharajan Venkatesan (Track Co-Chair), Nvidia

• Aishwarya Chithra, Qualcomm

• Marshnil Dave, Amber Semiconductor

• Matthias Korb, Universität der Bundeswehr München

• Prashanth Mohan, University of Pittsburgh

• Tanvi Sharma, Nvidia

• Adam Teman, Bar-Ilan University

• Theocharis Theocharides, University of Cyprus

• Daniel Wong, University of California, Riverside

• Yang (Katie) Zhao, University of Minnesota, Twin Cities

▲TOP

2. CAD, Systems, and Software

2.1 CAD Tools and Methodologies

• Matthew Ziegler (Track Co-Chair), IBM

• Yuko Hara (Track Co-Chair), CNRS

• Caaliph Andriamisaina, CEA

• Donkyu Baek, Chungbuk National University

• Alessio Burrello, University of Bologna

• Leslie Hwang, Arizona State University

• Romain Lemaire, École de Technologie Supérieure

• Alberto Macii, Politecnico di Torino

• Enrico Macii, Politecnico di Torino

• Francesc Moll Echeto, Universitat Politecnica de Catalunya

• Anh Nguyen, Fujitsu

• Francesco Regazzoni, Politecnico di Milano

2.2 Systems and Platforms

• Hussam Amrouch (Track Co-Chair), Technical University of Munich

• Masanori Hashimoto (Track Co-Chair), Kyoto University

• Lilas Alrahis, Khalifa University

• Iraklis Anagnostopoulos, Southern Illinois University

• Ganapati Bhat, Washington State University

• Naehyuck Chang, Samsung Electronics Device Solutions America

• Pai Chou, University of California, Irvine

• William Fornaciari, Politecnico di Milano

• Taeyoung Kim, Intel

• Johann Knechtel, NYU

• Preeti Ranjan Panda, IIT Delhi

• Jaehyun Park, University of Ulsan

• Massimo Poncino, Politecnico di Torino

• Santhosh Kumar Rethinagiri, Infineon Technologies

• Marina Zapater, HEIG-VD / HES-SO

2.3 Software and Applications

• Aporva Amarnath (Track Co-Chair), AMD

• Jalil Boukhobza (Track Co-Chair), ENSTA-Bretagne

• Yuan-Hao Chang, NTU

• Daniel Chillet, IRISA

• Davide Conficconi, Politecnico di Milano

• Chien-Chung Ho, National Cheng Kung University

• Daniele Jahier Pagliari, Politecnico di Torino

• Monodeep Kar, IBM Research

• Victor Kartsch, ETH Zurich

• Young Geun Kim, Korea University

• Hamza Ouarnoughi, Canadian University Dubai

• Subhankar Pal, Meta

• Dong-hyeon Park, University of Michigan

• Camélia Slimani, IRIT

• Mengying Zhao, Shandong University

2.4 Hardware and System Security

• Jakub Breier (Track Co-Chair), TTControl GmbH

• Kaveh Shamsi (Track Co-Chair), UT Dallas

• Aydin Aysu, NCSU

• Anubhab Baksi, NTU

• Debapriya Basu Roy, IIT Kanpur

• Shivam Bhasin, NTU

• Urbi Chatterjee, IIT Kanpur

• Amitabh Das, AMD

• Anupam Golder, Georgia Tech

• Xiaolu Hou, Slovak University of Technology in Bratislava

• Vincent Immler, Oregon State University

• Dirmanto Jap, NTU

• Bernhard Jungk, Albstadt-Sigmaringen University

• Andreas Rechberger, Intel

• Marc Stottinger, RheinMain University of Applied Sciences

▲TOP

3. Crosscutting Topics

3.1. Analog, Mixed-Signal & Emerging AI Hardware

• Shaahin Angizi (Track Co-Chair), NJIT

• Priyadarshini Panda (Track Co-Chair), USC

• Muya Chang, NVIDIA

• Gourav Datta, Case Western University

• Dhruv Gajaria, Pacific Northwest National Laboratory

• Pedram Khalili, Northwestern University

• Pietro Mercati, Intel

• M. Hassan Najafi, Case Western University

• Sudeep Pasricha, Colorado State University

• Muhammad Rashedul Haq Rashed, University of Texas at Arlington

• Dayane Reis, USF

• Arman Roohi, University of Illinois at Chicago

• Hanchen Ye, ElastixAI

• Wenfeng Zhao, Binghamton University

3.2 Digital AI Hardware & Systems

• Youngjoo Lee (Track Co-Chair), KAIST

• Sai Qian Zhang (Track Co-Chair), NYU

• Hiromitsu Awano, Nagoya University

• Youngjin Cho, Furiosa

• Shaoyi Huang, Stevens Institute of Technology

• Shanshi Huang, Hong Kong University of Science and Technology

• Shubham Jain, IBM

• Jan Moritz Joseph, RWTH Aachen

• Ji-Hoon Kim, Hanyang University

• Bokyung Kim, NCSU

• Ziyun Li, Facebook

• Muhammad Shafique, NYU

• Zishen Wan, Georgia Institute of Technology