Organizers

General Co-Chairs

• Yuan Xie, PSU/AMD
• Tanay Karnik, Intel

Program Co-Chairs

• Renu Mehra, Synopsys
• Muhammad Khellah, Intel

Publicity Co-Chairs

• Deming Chen, UIUC
• Baris Taskin, Drexel University
• Jose L. Ayala, Complutense University of Madrid, Spain

Local Arrangement Co-Chairs

• Xiangyu Dong, Qualcomm
• John (Jack) Sampson, Penn State University

Local Arrangement Co-Chairs for TPC Meeting

• Puneet Gupta, UCLA
• Jason Cong, UCLA

Industrial Liaison

• Eren Kursun, IBM

Publications Chair

• Paul Wesling, IEEE

Design Contest Chairs

• Mingoo Seok, Columbia University
• Yiran Chen, University of Pittsburgh

Treasurer

• Yu Wang, Tsinghua University

Web Chair

• Theo Theocharides, University of Cyprus

Executive Committee

• Massoud Pedram (EC Chair), University of Southern California
• Naehyuck Chang, Seoul National University
• Jason Cong, University of California, Los Angeles
• Vivek De, Intel Corporation
• Joerg Henkel, Karlsruhe Institute of Technology
• Rajiv Joshi, IBM TJ Watson Research Center
• Pai Chou, University of California, Irvine
• Enrico Macii, Politecnico di Torino
• Diana Marculescu, Carnegie Mellon University
• Wolfgang Nebel, Carl von Ossietzky Universität Oldenburg
• Hiroshi Nakamura, The University of Tokyo
• Vijaykrishnan Narayanan, Pennsylvania State
• Vojin Oklobdzija, New Mexico State University
• Massimo Poncino, Politecnico Di Torino
• Jan M. Rabaey, University of California, Berkeley
• Anand Raghunathan, Purdue University
• Kaushik Roy, Purdue University
• Takayasu Sakurai, The University of Tokyo
• Naresh Shanbhag, UIUC
• Mircea Stan, University of Virginia
• Vivek Tiwari, Intel Corporation