Technical Program Committee Members

Technical Program Committee Chairs

• Renu Mehra, Synopsys Inc.
• Muhammad Khellah, Intel Corp.

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Track Members

Topic 1.1: Technologies

• Saibal Mukhopadhyay, Georgia Tech University
• Arijit Raychowdhury, Georgia Tech University
• Jaydeep Kulkarni, Intel
• Jae-Joon Kim, Pohang University of Science and Technology
• Azad Naeemi, Georgia Tech University

Topic 1.2: Circuits

• Yogesh Ramadass, TI
• Srini Sridhara, TI
• Kevin Cao, Arizona State University
• Vikas Chandra, ARM
• Swaroop Ghosh, University of South Florida
• Mingoo Seok, Columbia University
• Joyce Kwong, TI
• Jae-sun Seo, Arizona State University
• Carlos Tokunaga, Intel
• Sengoon Toh, ARM
• Matthew Ziegler, IBM
• Byunghoo Jung, Purdue university
• Peter Levine, University of Waterloo
• Lei Wang, University of Connecticut
• David Wentzlof, University of Michigan
• Roozbeh Jafari, University of Texax, Dallas
• Jie Gu, Maxlinear, Inc.
• Mohamed Abu-Rahma, Apple
• Ethan Yi-Chun, Shih TSMC
• Tony Kim, Nanyang Technological University, Singapore
• Amin Khajeh Djahromi, Broadcom

Topic 1.3: Logic and Architecture

• Hans Jacobson, IBM
• Hai (Helen) Li, University of Pittsburgh
• David Garrett, Broadcom
• Soontae Kim, KAIST University, S. Korea
• Nam Sung Kim, University of Wisconsin, Madison
• Masaaki Kondo, University of Electro-Communications, Japan
• Xiaoyao Liang, Shanghai Jiao Tong University
• Sandeep Navada, North Carolina State University
• Guangyu Sun, Peking University
• Thomas Wenisch, University of Michigan
• Antonia Zhai, University of Minnesota
• Sheng Li, HP
• Anuradha Srinivasan, Intel
• Sarma Vrudhula, Arizona State University
• Wei Wu, Intel
• Erin Kursun, IBM
• John (Jack) Sampson, Pennsylvania State University
• Hiroki Matsutani, Keio University
• Xi Chen, Qualcomm
• Dimin Niu, Samsung

Topic 2.1: CAD Tools and Methodologies

• David Pan, University of Texas, Austin
• Deming Chen, University of Illinois, Urbana-Champaign
• Ruchir Puri, IBM
• Domenik Helms, OFFIS
• Jiang Hu, Texas A&M University
• Taemin Kim, Intel
• Yongpan Liu, Tsinghua University, China
• Enrico Macii, Polytechnic University of Turin
• Mustafa Ozdal, Intel, Inc
• David Atienza, EPFL, Switzerland
• Ravishankar Rao, Synopysys
• Koushik Chakraborty, Utah State University

Topic 2.2: Systems and Platforms

• Naehyuck Chang, Seoul National University
• Massimo Poncino, Polytechnic University of Turin
• Elaheh Bozorgzadeh, University of California, Irvine
• Tohru Ishihara, Kyoto University
• Qinru Qiu, Syracuse University
• Li Shang, University of Colorado, Boulder
• Chia-Lin Yang, National Taiwan University
• Xiangyu Dong, Qualcomm
• Yu Wang, Tsinghua University, China
• Jason Xue, City University of Hong Kong
• Hao Yu, Nanyang Technological University, Singapore
• Anand Raghunathan, Purdue University
• Sheldon Tan, University of California, Riverside

Topic 2.3: Software and Applications

• Vijay Raghunathan, Purdue University
• Vivek Tiwari, Intel
• Yiran Chen, University of Pittsburgh
• Ann Gordon-Ross, University of Florida
• Yao Guo, Peking University
• Zili Shao, Hong Kong Polytechnic University
• Barry Pangle, NVIDIA Corp.