Technical Program Committee
Technical Program Committee Co-Chairs
- Jaydeep Kulkarni, Intel
- Thomas Wenisch, University of Michigan
1. Technology, Circuits, and Architecture
1.1 - 1.2 Technologies and Circuits
- • Swaroop Ghosh, Penn State University (track co-chair)
- • Chris Nicol, Wave Computing (track co-chair)
- • Fady Abouzeid, ST Microelectronics
- • Charles Augustine, Intel
- • Amr Fahim, Intel
- • Jie Gu, Northwestern University
- • Sumeet Gupta, Penn State University
- • Amin Khajeh, Broadcom
- • Sudhanshu Khanna, Texas Instruments
- • Jae-Joon Kim, POSTECH
- • Suhwan Kim, Seoul National University
- • Tae Hyoung (Tony) Kim, Nanyang Technological University
- • Jing Li, University of Wisconsin-Madison
- • Tsung-Te Liu, National Taiwan University
- • Chao Lu, Southern Illinois University Carbondale
- • Saibal Mukhopadhyay, Georgia Institute of Technology
- • Michael Niemier, University of Notre Dame
- • Somnath Paul, Intel
- • Rahul Rao, IBM
- • Arijit Raychowdhury, Georgia Institute of Technology
- • Jae-sun Seo, Arizona State University
- • Mingoo Seok, Columbia University
- • Aatmesh Shrivastava, Northeastern University
- • Carlos Tokunaga, Intel
- • Amit Trivedi, University of Illinois at Chicago
- • Paul Whatmough, Harvard University
- • Hyosik Won, Samsung
1.3 Logic and Architecture
2. CAD, Systems, and Software
- • Brett Meyer, McGill University (track co-chair)
- • John (Jack) Sampson, Penn State University (track co-chair)
- • Alper Buyuktosunoglu, IBM
- • Trevor E. Carlson, Uppsala University
- • Xi Chen, Qualcomm
- • Ron Dreslinski, University of Michigan
- • Xiaochen Guo, Lehigh University
- • Andreas Hansson, ARM
- • Koji Inoue, Kyushu University
- • Hans Jacobson, IBM
- • Jangwoo Kim, Seoul National University
- • Masaaki Kondo, The University of Tokyo
- • Matthias Korb, ETH Zurich
- • Hai (Helen) Li, Duke University
- • Hiroki Matsutani, Keio University
- • Sandeep Navada, Qualcomm
- • Rangharajan Venkatesan, NVIDIA
- • Lei Wang, University of Connecticut
- • Kathy Wilcox, AMD
- • Daniel Wong, University of California, Riverside
- • Antonia Zhai, University of Minnesota
- • Jishen Zhao, University of California, Santa Cruz
2.1 CAD Tools and Methodologies
- • David Z. Pan, University of Texas at Austin (track co-chair)
- • Matthew Ziegler, IBM (track co-chair)
- • Koushik Chakraborty, Utah State University
- • Deming Chen, University of Illinois at Urbana Champaign
- • Taemin Kim, Intel
- • Peng Li, Texas A&M University
- • Sung Kyu Lim, Georgia Institute of Technology
- • Yongpan Liu, Tsinghua University
- • Alberto Macii, Politecnico di Torino
- • Enrico Macii, Politecnico di Torino
- • John Redmond, Broadcom
- • Ting-Chi Wang, National Tsing Hua University
- • Hao Yu, Nanyang Technological University
2.2 Systems and Platforms
- • Eli Bozorgzadeh, University of California, Irvine (track co-chair)
- • Chaitali Chakrabarti, Arizona State University (track co-chair)
- • Luca Carloni, Columbia University
- • Naehyuck Chang, KAIST
- • Jian-Jia Chen, TU Dortmund University
- • Pai Chou, University of California, Irvine
- • Mehdi Kamal, University of Tehran
- • Hun Seok Kim, University of Michigan
- • Younghyun Kim, University of Wisconsin–Madison
- • Vivek Kozhikkottu, Intel
- • Robert LiKamWa, Arizona State University
- • Umit Ogras, Arizona State University
- • Massimo Poncino, Politecnico di Torino
- • Li Shang, University of Colorado at Boulder
- • Sheldon Tan, University of California at Riverside
- • Yu Wang, Tsinghua University
- • Qiang Xu, The Chinese University of Hong Kong
- • Jason Xue, City University of Hong Kong
2.3 Software and Applications
- • Yiran Chen, Duke University (track chair)
- • Sung Woo Chung, Korea University
- • Ann Gordon-Ross, University of Florida
- • Pi-Cheng Hsiu, Academia Sinica
- • Gokhan Memik, Northwestern University
- • Barry Pangrle, Esperanto Technologies Inc.
- • Vijay Raghunathan, Purdue University
- • Sherief Reda, Brown University
- • Weisong Shi, Wayne State University
- • Jacob Sorber, Clemson University
- • Vivek Tiwari, Intel